Mold manufacturing method and the molds formed using the method

1038
研究者名
所属
専門分野
Nano/Microsystems,Functional solid state chemistry,Electron device/Electronic equipment
特許名称
Mold manufacturing method and the molds formed using the method

シーズ概要

This invention provides an electrolytic thick-film metal mold with the feature that the adhesive force between the electroless nickel (Ni) plated film formed on the self-assembled film and the inorganic thin film on the substrate is greater than 10MPa and less than 50MPa. Embedding is also possible with nano-sized patterns and the shapes of three-dimensional structures.

共同発明者

SAITO, Mikiko Senior Researcher (Research Council (Research Organization) Institute for Nanoscience & Nanotechnology) (当時)

掲載日: 2014/04/03