Mold manufacturing method and the molds formed using the method
- 研究者名
- 所属
- 専門分野
-
Nano/Microsystems,Functional solid state chemistry,Electron device/Electronic equipment
- 特許名称
-
Mold manufacturing method and the molds formed using the method
シーズ概要
This invention provides an electrolytic thick-film metal mold with the feature that the adhesive force between the electroless nickel (Ni) plated film formed on the self-assembled film and the inorganic thin film on the substrate is greater than 10MPa and less than 50MPa. Embedding is also possible with nano-sized patterns and the shapes of three-dimensional structures.
共同発明者
SAITO, Mikiko Senior Researcher (Research Council (Research Organization) Institute for Nanoscience & Nanotechnology) (当時)
他のシーズ
掲載日:
2014/04/03