Mold manufacturing method and the molds formed using the method

1038
researcher's name
affiliation
research field
Nano/Microsystems,Functional solid state chemistry,Electron device/Electronic equipment
patent name
Mold manufacturing method and the molds formed using the method

summary

This invention provides an electrolytic thick-film metal mold with the feature that the adhesive force between the electroless nickel (Ni) plated film formed on the self-assembled film and the inorganic thin film on the substrate is greater than 10MPa and less than 50MPa. Embedding is also possible with nano-sized patterns and the shapes of three-dimensional structures.
posted: 2014/04/03