Electroforming Technique using Self-assembled Monolayer(SAM) for Modified Nanopatterns

2015-0303-04
researcher's name
affiliation
research field
Nano/Microsystems,Functional solid state chemistry,Electron device/Electronic equipment
keyword

predominance

・Electroless NiP nanoimprinting mold replicated from Self-assembled Monolayer (SAM) modified Nanopatterns 
・Elaborately manufactured in nano size and complicated form

background

・Additional value and functionalization of products 
・Super-high aspect ratio&Nano-fabrication achievement 
・It is hard process by the conventional electroless plating or sputtering process

summary

・Pretreatment process by SAM
・The metallic molds with super-high aspect ratio can be manufactured easily 

application/development

・Provide Ni electroforming mold with super-high aspect ratio (LEAP Co.,Ltd)

material

  • Fabrication process of electroless NiP nanoimprinting mold
  • Alumina with the high aspect ratio hall formed by anodic oxidation
  • The Ni stamper with the high aspect ratio that manufactured it by SAM, Ni electroforming to the above alumina

related paper

  • C. P. Lin, M. Saito, and T. Homma, “Fabrication of elctroless NiP nanoimprinting mold by replication of UV-treated and self-assembled-monolayer-modified cyclo-olefin polymer nanopatterns ”, Electrochemistry, Vol. 81 (2013) pp. 678-681
  • C. P. Lin, M. Saito, and T. Homma, “Nanoindentation analysis for mechanical properties of electroless NiP imprinting moldreplicated from self-assembled-monolayer modified master mold”, Jpn. J. Appl. Phys., Vol. 52, (2013)
  • C. P. Lin, M. Saito, and T. Homma, “Initial Catalyzation Analysis of Electroless NiP Nanoimprinting Mold Replicated from Self-assembled Monolayer Modified Nanopatterns”, Electrochimica Acta, Vol. 82, (2012) pp. 75 -81.
posted: 2015/03/03