Mold manufacturing method and the molds formed using the method

1038

researcher's name: about researcher HOMMA, Takayuki Professor
affiliation: Faculty of Science and Engineering School of Advanced Science and Engineering Department of Applied Chemistry
research field: Nano/Microsystems,Functional solid state chemistry,Electron device/Electronic equipment
patent name: Mold manufacturing method and the molds formed using the method

summary

This invention provides an electrolytic thick-film metal mold with the feature that the adhesive force between the electroless nickel (Ni) plated film formed on the self-assembled film and the inorganic thin film on the substrate is greater than 10MPa and less than 50MPa. Embedding is also possible with nano-sized patterns and the shapes of three-dimensional structures.

collaborative inventors

SAITO, Mikiko Senior Researcher (Research Council (Research Organization) Institute for Nanoscience ＆ Nanotechnology) (retired)

same researcher's seeds

posted: 2014/04/03