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2319
Life sciences Nanotechnology / Materials
posted:2020/04/14

複合ナノチューブを介した細胞内物質導入および抽出技術

MIYAKE, Takeo Associate Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
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2085
Manufacturing Technology
posted:2020/04/14
特開2020-35983

半導体素子接合構造及び接合構造の生成方法、接合剤

TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
高温環境で用いられるパワーデバイスにおいて、Niナノ粒子と、Niより硬度の小さい金属(例えばAl)のマイクロ粒子を混合したペースト等を接合剤として用いてデバイスの接合構造を形成する。デバイスと被接合体とを強固に接合できると共に、熱応力を緩和することで高温環境に対応でき、信頼性...
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427JPDIV
Manufacturing Technology
posted:2019/07/05
第6667765号

電極接続方法及び電極接続構造

TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
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1963
Information Communication
posted:2019/04/19
特開2019-45905

複数の時系列数値データに対する機械学習によるデータ挙動予測

FUJIMURA, Shigeru Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
正常動作時のプロセス変数の時系列データを取得し、予測対象となる予測変数と予測変数に影響を与える要因変数を特定する。所定時間中のこれらの変数の時系列データを入力データ、所定時間後の予測変数の時系列データを出力データとし、これらのデータを用いて畳み込みニューラルネットワークで学習...
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2019-0312-01
Nanotechnology / Materials
posted:2019/03/12

High Temperature Resistant Die Bonding Formed by Al/Ni Nano-particles Composite Paste

TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
collaborative researchers:TANAKA, Yasunori Research Associate
● Verification of void reduction effect by Al microparticle mixing ● Verification of stress relaxation effect of junction structure formed by Ni nano-/Al micro-particles composite paste● Evaluation of high heat resistance using SiC-SBD
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1131
Information Communication
posted:2014/04/03

Frequency multiplier

YOSHIMASU, Toshihiko Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
This is an invention related to the circuits that take out the integral multiple harmonic that is generated in the case that the transistors are operated in the vicinity of pinch-off in the frequency multipliers that are mainly used in communications devices.It is possible to ...
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