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めっきを用いた接合構造体、接合方法
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems) (retired)
半導体素子接合構造及び接合構造の生成方法、接合剤
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems) (retired)
高温環境で用いられるパワーデバイスにおいて、Niナノ粒子と、Niより硬度の小さい金属(例えばAl)のマイクロ粒子を混合したペースト等を接合剤として用いてデバイスの接合構造を形成する。デバイスと被接合体とを強固に接合できると共に、熱応力を緩和することで高温環境に対応でき、信頼性...
電極接続方法及び電極接続構造
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems) (retired)
2019-0312-01
Nanotechnology / Materials
posted:2019/03/12
High Temperature Resistant Die Bonding Formed by Al/Ni Nano-particles Composite Paste
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems) (retired)
collaborative researchers:TANAKA, Yasunori Research Associate (retired)
● Verification of void reduction effect by Al microparticle mixing ● Verification of stress relaxation effect of junction structure formed by Ni nano-/Al micro-particles composite paste● Evaluation of high heat resistance using SiC-SBD