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2085
Manufacturing Technology
posted：2020/04/14
特開2020-35983
特開2020-35983 半導体素子接合構造及び接合構造の生成方法、接合剤
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
高温環境で用いられるパワーデバイスにおいて、Ｎｉナノ粒子と、Ｎｉより硬度の小さい金属（例えばＡｌ）のマイクロ粒子を混合したペースト等を接合剤として用いてデバイスの接合構造を形成する。デバイスと被接合体とを強固に接合できると共に、熱応力を緩和することで高温環境に対応でき、信頼性...
427JPDIV
Manufacturing Technology
posted：2019/07/05
第6667765号
第6667765号 電極接続方法及び電極接続構造
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
2019-0312-01
Nanotechnology / Materials
posted：2019/03/12
High Temperature Resistant Die Bonding Formed by Al/Ni Nano-particles Composite Paste
TATSUMI, Kohei Professor (Faculty of Science and Engineering Graduate School of Information, Production, and Systems)
collaborative researchers：TANAKA, Yasunori Research Associate
● Verification of void reduction effect by Al microparticle mixing ● Verification of stress relaxation effect of junction structure formed by Ni nano-/Al micro-particles composite paste● Evaluation of high heat resistance using SiC-SBD
