Development of New Waveguide-mode Sensors

researcher's name
research field
Electronic materials/Electric materials,Power engineering/Power conversion/Electric machinery


1. “Development of waveguide-mode sensor for monitoring the status of plating solutions”
In recent years, electronic components have become increasingly compact and highly integrated. This is making it imperative that plating, which deposits metals on electronic components, provides more precise control. A key factor for control is the additive in the plating solution. However, the current management method of additives does not allow for prompt, simple, and accurate measurements. We are thus developing a waveguide-mode sensor, which will be a new detector that can solve all of these problems.      
2. “Development of waveguide-mode sensor for detecting trace heavy metal in water”
In recent years, in the area of environmental measurement, there is rising demand for sensors that can easily take measurements of toxic heavy metal that is included in the water. With the current water quality testing method, the detection processes are complex and time consuming, making it difficult to take swift measurements outdoors at the scene. We are thus developing a waveguide-mode sensor, a detector that can solve these problems.


Our laboratory is developing new waveguide-mode sensors, believing that various substances can be detected and substance constants can be measured using waveguide-mode sensors that have sensitivity, portability, and maneuverability. It is expected that sensors that have never existed will be developed by combining electrochemical-type methods and optical methods of waveguide mode sensors.
1. Realization of an all-in-one automatic solution management device that can automatically manage additives, in addition to the basic composition of plating solutions.
2. Realization of a sensor that can easily detect solutions with heavy metal content at levels of the environmental limit.


1. Realization of even more compact and highly integrated electronic components through sensitive detection of changes in the state of additives in plating solutions.
2. Realization of quantitative detection of heavy metal by controlling the applied voltage and sorting multiple heavy metals.


in situ measurements possible, corrosion-resistant, antifouling, detects trace heavy metal, has superior portability and maneuverability

purpose of providing seeds

Sponsord research, Collaboration research, Technical consultation


■Academic Awards: Many awards including the Institute of Electrical Engineers of Japan (IEEJ) Fellow; Consortium for Electric Power Technology Achievement Award; Professor Emeritus of Xi’an Jiaotong University; IEEJ Outstanding Achievement Award; IEEJ Fundamentals and Materials Society Special Award, Academic Contribution Award, M.Ieda Memorial Lecture Award; IEEE International Conference on Properties and Applications of Dielectric Materials; IEEJ Senior Member; U.S. IEEE DEIS Whitehead Memorial Award; and IEEJ Technical Committee on Dielectrics and Electrical Insulation (TC-DEI) Academic Contribution Award, Ieda Award


  • Reflected spectrum when plating solution was dripped on the surface of a detection plate for 0, 150, 400, and 580 minutes in plating tim
  • Reflected spectrum when pure water was dripped on the surface of a detection plate coated with a fluorine-based compound
  • Voltage dependence of the increased portion of electric current I
  • Detection of lead of baseline concentrations
posted: 2014/05/21