Hybrid Bonding at Low Temperature and Atmospheric Pressure

2022-0203-05

researcher's name: about researcher MIZUNO, Jun Guest Senior Researcher (retired)
affiliation
research field: Electron device/Electronic equipment,Nanobioscience,Intelligent mechanics/Mechanical systems,Electronic materials/Electric materials
keyword

background

● Mixed-signals integration by organic-inorganic hybrid structure

● Eco-friendly assembly process

summary

● Hybrid bonding of Cu, PDMS, and quartz at 150 ℃ and atmospheric pressure

predominance

● Covalent, ionic, metal, and organic materials can be assembled in single process, at 150 ℃ in ambient air

● VUV/vapor-assisted surface modification method : Simple and easy-to-tune bonding process

application/development

● Low cost, Eco-friendly joining device for mounting :

structure only chamber apparatus, light source and humidifying

● New devices with functional interface such as transmission :

mixed optical device and bio MEMS sensor

material

collaborative researchers

SHOJI, Shuichi Professor (Faculty of Science and Engineering School of Fundamental Science and Engineering Department of Electronic and Photonic Systems) (retired) , 重藤暁津

same researcher's seeds

posted: 2022/02/03