High Temperature Resistant Die Bonding Formed by Al/Ni Nano-particles Composite Paste
2019-0312-01
- researcher's name
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about researcher TATSUMI, Kohei Professor (retired)
- affiliation
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Faculty of Science and Engineering Graduate School of Information, Production, and Systems
- research field
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Structural/Functional materials
- keyword
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background
● Low temperature sintering bonding by Ag nanoparticles and Cu nanoparticles has attracted attention as a high heat resistant bonding technology for SiC power device interconnection.
● The problems of Corrosion, oxidation and cost in Ag nanoparticles and Cu nanoparticles
● Generation of voids larger than micro size after sintering
● Decrease in bonding reliability due to thermal stress caused by difference in thermal expansion coefficient (CTE) between the element and the substrate
● The problems of Corrosion, oxidation and cost in Ag nanoparticles and Cu nanoparticles
● Generation of voids larger than micro size after sintering
● Decrease in bonding reliability due to thermal stress caused by difference in thermal expansion coefficient (CTE) between the element and the substrate
summary
● Verification of void reduction effect by Al microparticle mixing
● Verification of stress relaxation effect of junction structure formed by Ni nano-/Al micro-particles composite paste
● Evaluation of high heat resistance using SiC-SBD
● Verification of stress relaxation effect of junction structure formed by Ni nano-/Al micro-particles composite paste
● Evaluation of high heat resistance using SiC-SBD
predominance
● Ni nanoparticle bonding can be applied for the direct bonding to Al in the atmosphere.
● The Ni nano-/Al micro-particles composite bonding layer has heat resistance at 250℃ or higher.
● The Al micro-particles in the bonding layer are expected to have voids reduction effect and a stress relaxation effect.
● The Ni nano-/Al micro-particles composite bonding layer has heat resistance at 250℃ or higher.
● The Al micro-particles in the bonding layer are expected to have voids reduction effect and a stress relaxation effect.
application/development
● HEV/EV
● Inverter of industrial motor
● New energy field
● Inverter of industrial motor
● New energy field
collaborative researchers
TANAKA, Yasunori Research Associate (retired)
posted:
2019/03/12