Electroforming Technique using Self-assembled Monolayer(SAM) for Modified Nanopatterns

2015-0303-04
researcher's name
about researcher HOMMA, Takayuki Professor
affiliation
Faculty of Science and Engineering School of Advanced Science and Engineering Department of Applied Chemistry
research field
Nano/Microsystems,Functional solid state chemistry,Electron device/Electronic equipment
keyword

predominance

・Electroless NiP nanoimprinting mold replicated from Self-assembled Monolayer (SAM) modified Nanopatterns 
・Elaborately manufactured in nano size and complicated form

background

・Additional value and functionalization of products 
・Super-high aspect ratio&Nano-fabrication achievement 
・It is hard process by the conventional electroless plating or sputtering process

summary

・Pretreatment process by SAM
・The metallic molds with super-high aspect ratio can be manufactured easily 

application/development

・Provide Ni electroforming mold with super-high aspect ratio (LEAP Co.,Ltd)

material

  • Fabrication process of electroless NiP nanoimprinting mold
  • Alumina with the high aspect ratio hall formed by anodic oxidation
  • The Ni stamper with the high aspect ratio that manufactured it by SAM, Ni electroforming to the above alumina

collaborative researchers

SAITO, Mikiko Senior Researcher (Research Council (Research Organization) Institute for Nanoscience & Nanotechnology)

related paper

  • C. P. Lin, M. Saito, and T. Homma, “Fabrication of elctroless NiP nanoimprinting mold by replication of UV-treated and self-assembled-monolayer-modified cyclo-olefin polymer nanopatterns ”, Electrochemistry, Vol. 81 (2013) pp. 678-681
  • C. P. Lin, M. Saito, and T. Homma, “Nanoindentation analysis for mechanical properties of electroless NiP imprinting moldreplicated from self-assembled-monolayer modified master mold”, Jpn. J. Appl. Phys., Vol. 52, (2013)
  • C. P. Lin, M. Saito, and T. Homma, “Initial Catalyzation Analysis of Electroless NiP Nanoimprinting Mold Replicated from Self-assembled Monolayer Modified Nanopatterns”, Electrochimica Acta, Vol. 82, (2012) pp. 75 -81.

same researcher's seeds

  • The new interface measuring device using new plasmon sensor and raman scattering spectroscopy
  • Mold manufacturing method and the molds formed using the method
posted: 2015/03/03