Hard-gold film technology for the realization of low-resistance and high mechanical strength

researcher's name
about researcher OSAKA, Tetsuya Senior Research Professor (retired)
research field
Device related chemistry,Nanobioscience,Electronic materials/Electric materials


Hard-gold film is used for electronic contact materials including USB terminals, and plays a role for the transfer of information and provision of electricity among analog and digital products. There is a need to improve electronic properties as well as chemical and mechanical qualities beyond the current levels for connection materials.


This technology introduces carbon to hard AuNi film, making the structure of the film amorphous, and producing AuNiC film with greatly heightened abrasion resistance without lowering its electric resistance. A technology concerning the manufacturing of AuNiC film.


A current hard gold film surrogate and next-generation micro-connection film.


The cost of gold accounts for over 90% of the composition cost of gold coating film. The film used by this project is a thinner film with good mechanical properties, enabling effective cost cutting. In addition, it is possible to apply this technology’s high sustainment of electric transmission to fine connection materials including microscopic connectors. In addition to crystalline and amorphous gold film compositions, by increasing the amount of carbon, this same method can also create grapheme film, as shown in the diagram, and for the creation of nickel carbide film by removing the material’s auric salts. 

purpose of providing seeds

Sponsord research, Collaboration research, Technical consultation


  • Controlling the structure of the AuNiC film using a carbon euticoid (a cross-sectional TEM image)

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posted: 2014/05/21