Electroless copper plating bath, electroless copper plating method, and ULSI copper wiring formation method

651
researcher's name
affiliation
research field
Device related chemistry,Nanobioscience,Electronic materials/Electric materials
patent name
Electroless copper plating bath, electroless copper plating method, and ULSI copper wiring formation method

summary

While preventing the formation of defects such as voids as far as possible, it can also embed trenches efficiently. Furthermore, without using the dry method for the formation of the seed layer, which makes it difficult for uniform attachment to fine trenches, all processes are made up of wet processes, making the process of embedding baths for trenches more uniform and steady.

collaborative inventors

長谷川 円

posted: 2014/04/03