Laminated structures, ULSI circuit boards, and their formation methods

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researcher's name
affiliation
research field
Device related chemistry,Nanobioscience,Electronic materials/Electric materials
patent name
Laminated structures, ULSI circuit boards, and their formation methods

summary

This invention is related to metal structure and electroless plating processes that are used to embed copper in miniaturization trenches (grooves)/via with particularly high aspect ratio, in the field of multilayer wiring formation technology for ultra large-scale integrated circuits (ULSI). Through this technology, it is possible to construct completely electroless plating processes.

collaborative inventors

吉野  正洋

posted: 2014/04/03